Join Sun-Fly in the FESPA Digital 2016 in Amsterdam

2016-02-16

 

SUN-FLY will be attending the FESPA Amsterdam 2016 this March 8 to 11.


We are going to bring our latest products to this grand event,including 3D Vacuumsub Heat Press,
3D Phone Cases and other sublimation blanks.

This exhibition is a perfect opportunity for us to show you our new products and discuss business with you

face to face. Please do not hesitate to contact us for further information as soon as possible.

Everyone here at SUN-FLY look forward to meet you on site.